Technical Program Manager - Advanced Packaging, Electronics

Date: Oct 9, 2021

Location: remote – N/A, US, 19428

Company: Heraeus

Technical Program Manager - Advanced Packaging, Electronics
Location remote – N/A
Full Time

Imagine a job where you will have the opportunity to do exciting and challenging work, while collaborating with extraordinary colleagues. A company that invests in you and your career, providing the training, mentoring, development and support you need to be successful now and in the future. If you want a career without limits with a market-leading family-owned, global company where you can make an impact, then imagine an opportunity at Heraeus. Every day, our worldwide team of approximately 14,900 employees are bringing forward new ideas and solutions that are impacting and transforming everything from healthcare to renewable energy to e-mobility to high-tech and telecommunications.



As an employer, we offer open space - For Designers. For Forward Thinkers. For Doers. Innovation has been the secret of our sustained business success for 165 years, and you can have the opportunity to apply your knowledge to help us write that next chapter of success.

Here are just a few of the things you will get to do:

  • The primary responsibility of this position is to provide current and potential customers with technical support regarding products, applications, and issues, on-site support and qualifying both new product introductions and existing Heraeus’ Advanced Packaging products.
  • Work closely with the Technical Solutions team in Singapore in order to drive business development initiatives in cooperation with sales.
  • Act as a project leader for customer-specific projects and solutions. Lead cross-functional teams to address complex technical problems or customer issues.  Track solution development timeline, production processes and identify critical processes.
  • Drive Support technically in a pre-sales through post-sales phase. Provide technical training and manage technical issues on customer projects.
  • Support product marketing and innovation in specifying, characterizing and launching new products. Work closely with Innovation to service and qualify both new product introductions and existing Heraeus products.
  • Analyze/identify/resolve technical problems or issues from customers in order to maintain and increase business.
  • Maintain continuous knowledge of technical developments in the field by obtaining information through industry reports, literature and patents. Represent Heraeus Electronics attending technical conferences, trade shows, and educational courses as it relates to existing and future Advanced Packaging technologies.



We are looking for people who are not just open to new ideas, but want to bring fresh thinking, energy and a creative perspective to their work. Some of the traits and qualifications the ideal candidate would possess include:

  • A minimum of a Bachelors Degree in Material Science, Chemistry, Physics or Engineering and a minimum of 10 years of experience working within the semiconductor packaging/assembly industry are required. The equivalent combination of education and experience will be considered.
  • Must have a deep technical knowledge of advanced packaging technologies, key areas of surface mount technology and processes such as Flipchip, System-in-Package, wafer bumping and demonstrate an understanding of these applications.  Knowledge of wafer-level-packaging is a plus.
  • Must have the ability to manage projects, schedule and prioritize effectively. 
  • Must have strong customer service orientation and communicate effectively both externally and internally. 
  • Demonstrate a high level of professionalism; exhibit a high level of motivation and initiative. 
  • Must be able to travel domestically and internationally in order to visit customers, present technical papers, and attend conferences. 

Nearest Major Market: Philadelphia